DUMP Honor 9 lite (LLD-L21) EMMC DUMP

Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HCG8a4 (0x484347386134), rev: 0xA1, serial number: 0x2A34E5AC
Manufacturing date: мар 2018
CID: 90014A48 43473861 34A12A34 E5AC354A
CSD: D0270132 8F5903FF FFFFFFEF 8A400026
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: hi6250, cpu abi: arm64-v8a
manufacturer: unknown
board: hi6250, name: hi6250
brand: hi6250, model:
build id: OPR6.170623.010, version: 8.0.0 Oreo (System 8.0.0.046(06HJ))
build description: generic_a15-user 8.0.0 OPR6.170623.010 eng.jslave.20180306.030914 test-keys
crypto state: encrypted?