EMMC Device Information :
EMMC CID: 15010044503644424200D761DC635987
EMMC CSD: D0270132 F5903FFF6DBFFEF8E40400D
Manufacturer: SAMSUNG , NAME: DP6DBB , HEX: 445036444242 , S/N: D761DC63 , Rev: 00
Manufacturer ID: 15 , OEM ID: 00 , Device Type: BGA (Discrete embedded) , Date: 5/2022
EMMC ROM 1 (Main User Data) Capacity: 59640 MB (0x000E8F800000)
EMMC ROM 2/3 (Boot Partition 1/2) Capacity: 4096 KB (0x000000400000)
EMMC RPMB Capacity: 16384 KB (0x000001000000) , Counter: 1006 , Response: Not Clean
Extended CSD Information :
Extended CSD rev: 1.8 (MMC 5.1)
Boot configuration [PARTITION_CONFIG]: 0x48 , Boot partition 1 enabled for boot , Boot ACK
Boot Bus Config: 0x02 , x8 (sdr/ddr) bus width in boot operation mode
H/W Reset Function [RST_N_FUNCTION]: 0x01 , RST_n signal is permanently enabled
Supported partition features [PARTITIONING_SUPPORT]: 0x07
Partition settings [PARTITION_SETTING_COMPLETED]: 0x00
EMMC CID: 15010044503644424200D761DC635987
EMMC CSD: D0270132 F5903FFF6DBFFEF8E40400D
Manufacturer: SAMSUNG , NAME: DP6DBB , HEX: 445036444242 , S/N: D761DC63 , Rev: 00
Manufacturer ID: 15 , OEM ID: 00 , Device Type: BGA (Discrete embedded) , Date: 5/2022
EMMC ROM 1 (Main User Data) Capacity: 59640 MB (0x000E8F800000)
EMMC ROM 2/3 (Boot Partition 1/2) Capacity: 4096 KB (0x000000400000)
EMMC RPMB Capacity: 16384 KB (0x000001000000) , Counter: 1006 , Response: Not Clean
Extended CSD Information :
Extended CSD rev: 1.8 (MMC 5.1)
Boot configuration [PARTITION_CONFIG]: 0x48 , Boot partition 1 enabled for boot , Boot ACK
Boot Bus Config: 0x02 , x8 (sdr/ddr) bus width in boot operation mode
H/W Reset Function [RST_N_FUNCTION]: 0x01 , RST_n signal is permanently enabled
Supported partition features [PARTITIONING_SUPPORT]: 0x07
Partition settings [PARTITION_SETTING_COMPLETED]: 0x00
